Volume 50

The influence mechanism of external electric field on the control of solid-liquid interface heat flux Xueling Liu, Yunkai Leng, Jia Hao, Jiansheng Wang

Abstract

In response to the problem of using cooling fluid to cool the bottom surface of components or devices, this study adds charged particles to the cooling fluid and regulates the heat flow by adjusting the electric field strength. In order to explore the microscopic mechanism of the effect of electric field strength on the heat transfer process in micro- and nano-fluidic channels, the convective heat transfer characteristics of argon fluid cooling on a platinum wall under different electric field strengths are simulated using the molecular dynamics method. A molecular dynamics (MD) model for the convective heat transfer of argon fluid in microchannels is established and the heat transfer process is simulated under different electric field strengths. The radial distribution functions (RDFs), vibrational density of states (VDOS) and atomic distribution functions of the atoms in the system are calculated, and the microscopic mechanism of convective heat transfer between argon fluid and platinum wall is analyzed. The influence of electric field intensity on the temperature and velocity distribution of the argon fluid is studied. The variation law of Nusselt number (Nu) and its controlling effect on the direction of the heat flow are analyzed. The results show that increasing the electric field intensity can improve the convective heat transfer characteristics in microchannels. Compared with no electric field, when the electric field intensity is 2.0V/nm, the Nu at the bottom and the top surfaces are increased by 42% and 56%, respectively. The temperature difference between the inlet and outlet is increased by 22.4%, the external temperature is reduced by 109.2K.

Keywords Heat flow control, interface thermal resistance, flow heat transfer, electric field